Awọn ọja
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Irin ti a ka specifically for the lithium battery manufacturing industry. Yi eekan-pẹlẹbẹ Eccloltytic yii ni awọn anfani ti mimọ giga, impurities ti o dara, ipari oju ilẹ to dara, ilẹ alapin, ẹdọfu kan, ati didi aidibajẹ. Pẹlu mimọ ti o ga julọ ati hydrophilic ti o dara julọ, involky corm bankanje fun awọn batiri le ni ilosoke idiyele ati ṣiṣan awọn akoko ati fa igbesi aye ipin ti awọn batiri. Ni akoko kan naa,Irin ti a ka
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Irin ti a ka roughness and high peel strength. Ipafinọpo Ejò ti a ṣe nipasẹ ilana ilana itanna ni awọn anfani ti mimọ giga, awọn impurities kekere, apẹrẹ alapin, apẹrẹ igbimọ alapin, ati iwọn nla. The electrolytic copper foil can be better laminated with other materials after roughening on one side, and it is not easy to peel off.
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electrolytic copper foil is a copper foil that has been roughened to varying degrees on both sides. Eyi ni okun agbara ti awọn ẹgbẹ mejeeji ti awọn ẹgbẹ mejeeji ti bankanje idẹ, ṣiṣe awọn ti o rọrun lati lo bi Layegbele agbedemeji fun awọn ohun elo miiran. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.
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Ejò iní omiiran Ejò inís. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance isbetter than similar copper foil products. Niwọn bi o ti jẹ pe apo-apo idẹ yii da lori ilana itanna, ko ni girita, eyiti o jẹ ki o rọrun pẹlu awọn ohun elo TPI ni awọn iwọn otutu to ga.
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Irin ti a ka Kii ṣe adaṣe iṣe itanna to dara nitori mimọ giga ti Ejò, ṣugbọn tun rọrun lati ett ati pe o le ni ifamọra itanna itanna itanna itanna itanna itanna itanna ati kikọlu macrowafu. Ilana iṣelọpọ electrolytic ngbanilaaye fun iwọn ti o pọ julọ ti awọn mita to pọ julọ tabi diẹ sii, gbigba fun awọn ohun elo rirọ ni ọpọlọpọ awọn aaye pupọ. The copper foil itself has a very flat shape and can be perfectly molded to other materials. Banki ti o ni idẹ tun tun sooro si ifosisipo otutu otutu ati ipasẹ, ṣiṣe ti o dara fun lilo ni awọn agbegbe awọn ibeere ti o munadoko.
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Irin nickel ni iduroṣinṣin giga ni afẹfẹ, agbara ifọrọbọ ti o nipọn, le koju ipa-ọna ti o nipọn ni afẹfẹ ati ororo alkaline, ko rọrun nikan loke 600℃; nickel plating layer has strong adhesion, not easy to fall off; Ni afikun Nickel Layer le jẹ dada ohun elo nira, le ṣe ilọsiwaju ọja ti iṣelọpọ wọ ati apọju itanjẹ, awọn ọja wọ resistance, iṣẹ ṣiṣe ibajẹ rusi jẹ o tayọ.
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