[VLP] Profaili Kekere pupọ ED Ejò bankanje
![[VLP] Profaili Kekere pupọ ED bankanje Aworan Ifihan](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil.png)
Ọja Ifihan
VLP, bankanje elekitiki elekitiroti profaili kekere pupọ ti a ṣe nipasẹ CIVEN METAL ni awọn abuda ti aibikita kekere ati agbara peeli giga.Bakanna Ejò ti iṣelọpọ nipasẹ ilana eletiriki ni awọn anfani ti mimọ giga, awọn impurities kekere, dada didan, apẹrẹ igbimọ alapin, ati iwọn nla.Awọn electrolytic Ejò bankanje le ti wa ni dara laminated pẹlu awọn ohun elo miiran lẹhin roughening lori ọkan ẹgbẹ, ati awọn ti o jẹ ko rorun lati Peeli pa.
Awọn pato
CIVEN le pese profaili ultra-kekere iwọn otutu ductile electrolytic Ejò bankanje (VLP) lati 1/4oz si 3oz (sisanra ipin 9µm si 105µm), ati pe iwọn ọja ti o pọju jẹ 1295mm x 1295mm dì bàbà bankanje.
Iṣẹ ṣiṣe
CIVEN pese bankanje elekitiriki elekitiriki ti o nipọn pẹlu awọn ohun-ini ti ara ti o dara julọ ti okuta-iyẹwu equiaxial, profaili kekere, agbara giga ati elongation giga.(Wo Tabili 1)
Awọn ohun elo
Ti o wulo fun iṣelọpọ awọn igbimọ Circuit agbara-giga ati awọn igbimọ igbohunsafẹfẹ giga-giga fun adaṣe, agbara ina, ibaraẹnisọrọ, ologun ati oju-ofurufu.
Awọn abuda
Afiwera pẹlu iru ajeji awọn ọja.
1.The ọkà be ti wa VLP electrolytic Ejò bankanje ti wa ni equiaxed itanran gara iyipo;nigba ti ọkà be ti iru ajeji awọn ọja jẹ columnar ati ki o gun.
2. Electrolytic Ejò bankanje ni olekenka-kekere profaili, 3oz Ejò bankanje gross dada Rz ≤ 3.5µm;Lakoko ti awọn ọja ajeji ti o jọra jẹ profaili boṣewa, 3oz Ejò bankanje gross dada Rz> 3.5µm.
Awọn anfani
1.Since ọja wa ni ultra-low profile, o solves awọn ti o pọju ewu ti awọn ila kukuru Circuit nitori awọn ti o tobi roughness ti awọn boṣewa nipọn Ejò bankanje ati awọn rorun ilaluja ti awọn tinrin idabobo dì nipasẹ awọn "Ikooko ehin" nigba titẹ awọn ni ilopo-apa nronu.
2.Because awọn ọkà be ti awọn ọja wa ti wa ni equiaxed itanran gara iyipo, o shortens awọn akoko ti ila etching ati ki o mu awọn isoro ti uneven ila ẹgbẹ etching.
3, lakoko ti o ni agbara peeli giga, ko si gbigbe lulú Ejò, iṣẹ ṣiṣe iṣelọpọ PCB ti o han gbangba.
Iṣe (GB/T5230-2000, IPC-4562-2000)
| Iyasọtọ | Ẹyọ | 9μm | 12μm | 18μm | 35μm | 70μm | 105μm | |
| Cu akoonu | % | ≥99.8 | ||||||
| Iwọn Agbegbe | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | 585±10 | 875±15 | |
| Agbara fifẹ | RT(23℃) | Kg/mm2 | ≥28 | |||||
| HT (180℃) | ≥15 | ≥18 | ≥20 | |||||
| Ilọsiwaju | RT(23℃) | % | ≥5.0 | ≥6.0 | ≥10 | |||
| HT (180℃) | ≥6.0 | ≥8.0 | ||||||
| Irora | Shiny(Ra) | μm | ≤0.43 | |||||
| Matte(Rz) | ≤3.5 | |||||||
| Peeli Agbara | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.9 | ≥1.0 | ≥1.5 | ≥2.0 |
| Oṣuwọn idinku ti HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||||
| Iyipada awọ (E-1.0hr/200℃) | % | O dara | ||||||
| Solder Lilefoofo 290 ℃ | iṣẹju-aaya | ≥20 | ||||||
| Irisi (Aami ati erupẹ bàbà) | ---- | Ko si | ||||||
| Pinhole | EA | Odo | ||||||
| Ifarada Iwọn | Ìbú | mm | 0 ~ 2mm | |||||
| Gigun | mm | ---- | ||||||
| Koju | Mm/inch | Inu Iwọn 79mm/3 inch | ||||||
Akiyesi:1. Awọn Rz iye ti Ejò bankanje gross dada ni igbeyewo idurosinsin iye, ko kan ẹri iye.
2. Peeli agbara ni boṣewa FR-4 ọkọ igbeyewo iye (5 sheets ti 7628PP).
3. Akoko idaniloju didara jẹ awọn ọjọ 90 lati ọjọ ti o gba.
![[RTF] Yiyipada ED Ejò bankanje](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Batiri ED Ejò bankanje](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[HTE] Giga Elongation ED Ejò bankanje](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil-300x300.png)