[RTF] Yiyipada ED Ejò bankanje
![[RTF] Yiyipada ED Ejò bankanje Aworan ifihan](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil.png)
Ọja Ifihan
RTF, bankanje elekitiriki elekitiriki ti a ṣe itọju pada jẹ bankanje idẹ kan ti o ti ni iwọn si awọn iwọn oriṣiriṣi ni ẹgbẹ mejeeji.Eyi ṣe okunkun agbara peeli ti awọn ẹgbẹ mejeeji ti bankanje bàbà, ṣiṣe ki o rọrun lati lo bi Layer agbedemeji fun sisopọ si awọn ohun elo miiran.Pẹlupẹlu, awọn ipele oriṣiriṣi ti itọju ni ẹgbẹ mejeeji ti bankanje bàbà jẹ ki o rọrun lati etch ẹgbẹ tinrin ti Layer roughened.Ninu ilana ti ṣiṣe igbimọ Circuit ti a tẹjade (PCB), ẹgbẹ ti a tọju ti bàbà ni a lo si ohun elo dielectric.Ẹgbẹ ilu ti a ṣe itọju jẹ rougher ju apa keji, eyiti o jẹ ifaramọ nla si dielectric.Eleyi jẹ akọkọ anfani lori boṣewa electrolytic Ejò.Awọn ẹgbẹ matte ko nilo eyikeyi darí tabi itọju kemikali ṣaaju si ohun elo ti photoresist.O ti wa ni inira to lati ni ti o dara laminating koju adhesion.
Awọn pato
CIVEN le pese bankanje elekitiriki RTF pẹlu sisanra ipin ti 12 si 35µm to iwọn 1295mm.
Iṣẹ ṣiṣe
Awọn ga otutu elongation ifasilẹ awọn itọju electrolytic Ejò bankanje ti wa ni tunmọ si kan kongẹ plating ilana lati šakoso awọn iwọn ti awọn Ejò èèmọ ati pinpin wọn boṣeyẹ.Ilẹ oju didan ti o yipada ti bankanje bàbà le dinku aifokanbalẹ ti bankanje bàbà ti a tẹ papọ ati pese agbara peeli to ti bankanje bàbà.(Wo Tabili 1)
Awọn ohun elo
Le ṣee lo fun awọn ọja igbohunsafẹfẹ giga ati awọn laminates inu, gẹgẹbi awọn ibudo ipilẹ 5G ati radar ọkọ ayọkẹlẹ ati awọn ohun elo miiran.
Awọn anfani
Agbara imora ti o dara, lamination olona-Layer taara, ati iṣẹ etching to dara.O tun dinku agbara fun kukuru kukuru ati kikuru akoko ilana ilana.
Table 1. Performance
| Iyasọtọ | Ẹyọ | 1/3OZ (12μm) | 1/2OZ (18μm) | 1OZ (35μm) | |
| Cu akoonu | % | min.99.8 | |||
| Iwọn Agbegbe | g/m2 | 107±3 | 153±5 | 283±5 | |
| Agbara fifẹ | RT(25℃) | Kg/mm2 | min.28.0 | ||
| HT (180℃) | min.15.0 | min.15.0 | min.18.0 | ||
| Ilọsiwaju | RT(25℃) | % | min.5.0 | min.6.0 | min.8.0 |
| HT (180℃) | min.6.0 | ||||
| Irora | Shiny(Ra) | μm | o pọju.0.6 / 4.0 | o pọju.0.7 / 5.0 | o pọju.0.8 / 6.0 |
| Matte(Rz) | o pọju.0.6 / 4.0 | o pọju.0.7 / 5.0 | o pọju.0.8 / 6.0 | ||
| Peeli Agbara | RT(23℃) | Kg/cm | min.1.1 | min.1.2 | min.1.5 |
| Oṣuwọn idinku ti HCΦ(18%-1hr/25℃) | % | o pọju.5.0 | |||
| Iyipada awọ (E-1.0hr/190℃) | % | Ko si | |||
| Solder Lilefoofo 290 ℃ | iṣẹju-aaya | o pọju.20 | |||
| Pinhole | EA | Odo | |||
| Preperg | ---- | FR-4 | |||
Akiyesi:1. Awọn Rz iye ti Ejò bankanje gross dada ni igbeyewo idurosinsin iye, ko kan ẹri iye.
2. Peeli agbara ni boṣewa FR-4 ọkọ igbeyewo iye (5 sheets ti 7628PP).
3. Akoko idaniloju didara jẹ awọn ọjọ 90 lati ọjọ ti o gba.
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