[HTE] Giga Elongation ED Ejò bankanje
![[HTE] Giga Elongation ED Ejò bankanje ifihan Aworan](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Ọja Ifihan
HTE, ga otutu ati elongation Ejò bankanje yi nipasẹCIVEN irinni o tayọ resistance si ga awọn iwọn otutu ati ki o ga ductility. Awọn bankanje Ejò ko ni oxidize tabi yi awọ pada ni awọn iwọn otutu giga, ati pe ductility ti o dara jẹ ki o rọrun lati laminate pẹlu awọn ohun elo miiran. Bakanna Ejò ti iṣelọpọ nipasẹ ilana eletiriki ni oju ti o mọ pupọ ati apẹrẹ dì alapin. Awọn bankanje Ejò funrara rẹ jẹ roughened ni ẹgbẹ kan, eyiti o jẹ ki o rọrun lati faramọ awọn ohun elo miiran. Iwa mimọ ti bankanje bàbà jẹ giga pupọ, ati pe o ni itanna to dara julọ ati adaṣe igbona. Ni ibere lati pade awọn iwulo ti awọn onibara wa, a le pese kii ṣe awọn iyipo ti bankanje bàbà, ṣugbọn tun awọn iṣẹ slicing ti adani.
Awọn pato
Sisanra: 1/4OZ～20OZ(9µm～70µm)
Iwọn: 550mm～1295mm
Iṣẹ ṣiṣe
Ọja naa ni iṣẹ ibi ipamọ otutu otutu ti o dara julọ, iṣẹ resistance ifoyina otutu otutu, didara ọja lati pade boṣewa IPC-4562Ⅱ, Ⅲipele awọn ibeere.
Awọn ohun elo
Dara fun gbogbo iru eto resini ti apa meji, igbimọ Circuit titẹ multilayer
Awọn anfani
Ọja naa gba ilana itọju dada pataki kan lati mu agbara ọja dara lati koju ipata isalẹ ati dinku eewu eeku idẹ.
Iṣe (GB/T5230-2000, IPC-4562-2000)
| Iyasọtọ | Ẹyọ | 1/4OZ (9mm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Cu akoonu | % | ≥99.8 | ||||||
| Iwọn Agbegbe | g/m2 | 80±3 | 107±3 | 127± 4 | 153±5 | 283±5 | 585±10 | |
| Agbara fifẹ | RT(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT (180℃) | ≥15 | |||||||
| Ilọsiwaju | RT(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT (180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Irora | Shiny(Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Peeli Agbara | RT(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Oṣuwọn idinku ti HCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
| Iyipada awọ (E-1.0hr/190℃) | % | O dara | ||||||
| Solder Lilefoofo 290 ℃ | iṣẹju-aaya | ≥20 | ||||||
| Pinhole | EA | Odo | ||||||
| Preperg | ---- | FR-4 | ||||||
Akiyesi:1. Awọn Rz iye ti Ejò bankanje gross dada ni igbeyewo idurosinsin iye, ko kan ẹri iye.
2. Peeli agbara ni boṣewa FR-4 ọkọ igbeyewo iye (5 sheets ti 7628PP).
3. Akoko idaniloju didara jẹ awọn ọjọ 90 lati ọjọ ti o gba.
![[VLP] Profaili Kekere pupọ ED Ejò bankanje](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Yiyipada ED Ejò bankanje](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
![[BCF] Batiri ED Ejò bankanje](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)