[HTE] Giga Elongation ED Ejò bankanje
![[HTE] Giga Elongation ED Ejò bankanje ifihan Aworan](https://cdn.globalso.com/civen-inc/HTE-High-Elongation-ED-Copper-Foil.png)
Ọja Ifihan
HTE, ga otutu ati elongation Ejò bankanje yi nipasẹCIVEN irinni o tayọ resistance si ga awọn iwọn otutu ati ki o ga ductility. Awọn bankanje Ejò ko ni oxidize tabi yi awọ pada ni awọn iwọn otutu giga, ati pe ductility ti o dara jẹ ki o rọrun lati laminate pẹlu awọn ohun elo miiran. Bakanna Ejò ti iṣelọpọ nipasẹ ilana eletiriki ni oju ti o mọ pupọ ati apẹrẹ dì alapin. Awọn bankanje Ejò funrara rẹ jẹ roughened ni ẹgbẹ kan, eyiti o jẹ ki o rọrun lati faramọ awọn ohun elo miiran. Iwa mimọ ti bankanje bàbà jẹ giga pupọ, ati pe o ni itanna to dara julọ ati adaṣe igbona. Ni ibere lati pade awọn iwulo ti awọn onibara wa, a le pese kii ṣe awọn iyipo ti bankanje bàbà, ṣugbọn tun awọn iṣẹ slicing ti adani.
Awọn pato
Sisanra: 1/4OZ～20OZ(9µm～70µm)
Iwọn: 550mm～1295mm
Iṣẹ ṣiṣe
Ọja naa ni iṣẹ ibi ipamọ otutu otutu ti o dara julọ, iṣẹ resistance ifoyina otutu otutu, didara ọja lati pade boṣewa IPC-4562Ⅱ, Ⅲipele awọn ibeere.
Awọn ohun elo
Dara fun gbogbo iru eto resini ti ẹgbẹ-meji, igbimọ Circuit titẹ multilayer
Awọn anfani
Ọja naa gba ilana itọju dada pataki kan lati mu agbara ọja dara lati koju ipata isalẹ ati dinku eewu eeku idẹ.
Iṣe (GB/T5230-2000, IPC-4562-2000)
| Iyasọtọ | Ẹyọ | 1/4OZ (9mm) | 1/3OZ (12μm) | J OZ (15μm) | 1/2OZ (18μm) | 1OZ (35μm) | 2OZ (70μm) | |
| Cu akoonu | % | ≥99.8 | ||||||
| Iwọn Agbegbe | g/m2 | 80±3 | 107±3 | 127± 4 | 153±5 | 283±5 | 585±10 | |
| Agbara fifẹ | RT(25℃) | Kg/mm2 | ≥28 | ≥30 | ||||
| HT (180℃) | ≥15 | |||||||
| Ilọsiwaju | RT(25℃) | % | ≥4.0 | ≥5.0 | ≥6.0 | ≥10 | ||
| HT (180℃) | ≥4.0 | ≥5.0 | ≥6.0 | |||||
| Irora | Shiny(Ra) | μm | ≤0.4 | |||||
| Matte(Rz) | ≤5.0 | ≤6.0 | ≤7.0 | ≤7.0 | ≤9.0 | ≤14 | ||
| Peeli Agbara | RT(23℃) | Kg/cm | ≥1.0 | ≥1.2 | ≥1.2 | ≥1.3 | ≥1.8 | ≥2.0 |
| Oṣuwọn idinku ti HCΦ(18%-1hr/25℃) | % | ≤5.0 | ||||||
| Iyipada awọ (E-1.0hr/190℃) | % | O dara | ||||||
| Solder Lilefoofo 290 ℃ | iṣẹju-aaya | ≥20 | ||||||
| Pinhole | EA | Odo | ||||||
| Preperg | ---- | FR-4 | ||||||
Akiyesi:1. Awọn Rz iye ti Ejò bankanje gross dada ni igbeyewo idurosinsin iye, ko kan ẹri iye.
2. Peeli agbara ni boṣewa FR-4 ọkọ igbeyewo iye (5 sheets ti 7628PP).
3. Akoko idaniloju didara jẹ awọn ọjọ 90 lati ọjọ ti o gba.
![[BCF] Batiri ED Ejò bankanje](https://cdn.globalso.com/civen-inc/BCF-Battery-ED-Copper-Foil1-300x300.png)
![[VLP] Profaili Kekere pupọ ED Ejò bankanje](https://cdn.globalso.com/civen-inc/VLP-Very-Low-Profile-ED-Copper-Foil-300x300.png)
![[RTF] Yiyipada ED Ejò bankanje](https://cdn.globalso.com/civen-inc/RTF-Reverse-Treated-ED-Copper-Foil-300x300.png)
