ED Ejò Foils fun FPC
Ọja Ifihan
FCF, rọEjò bankanje ti wa ni Pataki ti ni idagbasoke ati ti ṣelọpọ fun awọn FPC ile ise (FCCL). Eleyi electrolytic Ejò bankanje ni o ni dara ductility, kekere roughness ati ki o dara Peeli agbara jumiiran Ejò bankanjes. Ni akoko kanna, awọn dada pari ati fineness ti awọn Ejò bankanje jẹ dara ati awọn kika resistance jẹpeludara ju iru Ejò bankanje awọn ọja. Niwọn igba ti bankanje bàbà yii da lori ilana elekitiroti, ko ni girisi, eyiti o jẹ ki o rọrun lati ni idapo pẹlu awọn ohun elo TPI ni awọn iwọn otutu giga.
Iwọn Iwọn:
Sisanra:9µm～35µm
Iṣẹ ṣiṣe
Ilẹ ọja naa jẹ dudu tabi pupa, o ni aibikita dada kekere.
Awọn ohun elo
Rọ Ejò Clad Laminate (FCCL), Fine Circuit FPC, LED ti a bo gara tinrin fiimu.
Awọn ẹya:
Iwọn iwuwo giga, resistance atunse giga ati iṣẹ etching ti o dara.
Ohun elo microstructure:
SEM (Ẹgbẹ ti o ni inira lẹhin itọju)
SEM (Ṣaaju Itọju Idaju)
SEM (Ẹgbẹ didan lẹhin itọju)
Table1- Iṣẹ (GB/T5230-2000, IPC-4562-2000):
| Iyasọtọ | Ẹyọ | 9μm | 12μm | 18μm | 35μm | |
| Cu akoonu | % | ≥99.8 | ||||
| Iwọn Agbegbe | g/m2 | 80±3 | 107±3 | 153±5 | 283±7 | |
| Agbara fifẹ | RT(23℃) | Kg/mm2 | ≥28 | |||
| HT (180℃) | ≥15 | ≥15 | ≥15 | ≥18 | ||
| Ilọsiwaju | RT(23℃) | % | ≥5.0 | ≥5.0 | ≥6.0 | ≥10 |
| HT (180℃) | ≥6.0 | ≥6.0 | ≥8.0 | ≥8.0 | ||
| Irora | Shiny(Ra) | μm | ≤0.43 | |||
| Matte(Rz) | ≤2.5 | |||||
| Peeli Agbara | RT(23℃) | Kg/cm | ≥0.77 | ≥0.8 | ≥0.8 | ≥0.8 |
| Oṣuwọn idinku ti HCΦ(18%-1hr/25℃) | % | ≤7.0 | ||||
| Iyipada awọ (E-1.0hr/200℃) | % | O dara | ||||
| Solder Lilefoofo 290 ℃ | iṣẹju-aaya | ≥20 | ||||
| Irisi (Aami ati erupẹ bàbà) | ---- | Ko si | ||||
| Pinhole | EA | Odo | ||||
| Ifarada Iwọn | Ìbú | mm | 0 ~ 2mm | |||
| Gigun | mm | ---- | ||||
| Koju | Mm/inch | Inu Iwọn 79mm/3 inch | ||||
Akiyesi: 1. Ejò bankanje ifoyina resistance išẹ ati dada iwuwo Ìwé le ti wa ni idunadura.
2. Atọka iṣẹ jẹ koko-ọrọ si ọna idanwo wa.
3. Akoko idaniloju didara jẹ awọn ọjọ 90 lati ọjọ ti o gba.
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