Electrodeposited (ED)Ejò bankanjejẹ ẹhin alaihan ti awọn ẹrọ itanna igbalode. Profaili rẹ ti o nipọn pupọ, ipalọlọ giga, ati adaṣe to dara julọ jẹ ki o ṣe pataki ninu awọn batiri litiumu, PCBs, ati ẹrọ itanna rọ. Ko dabiti yiyi Ejò bankanje, eyi ti o da lori idibajẹ ẹrọ,ED Ejò bankanjeti ṣejade nipasẹ ifisilẹ elekitiroki, iyọrisi iṣakoso ipele atomiki ati isọdi iṣẹ. Nkan yii ṣafihan pipe lẹhin iṣelọpọ rẹ ati bii awọn imotuntun ilana ṣe n yipada awọn ile-iṣẹ.
I. Imujade Iṣeduro: Itọkasi ni Imọ-ẹrọ Electrochemical
1. Electrolyte Igbaradi: A Nano-iṣapeye agbekalẹ
Electrolyte ipilẹ ni imi-ọjọ imi-ọjọ mimọ-giga (80-120g/L Cu²⁺) ati sulfuric acid (80–150g/L H₂SO₄), pẹlu gelatin ati thiourea ti a ṣafikun ni awọn ipele ppm. Awọn ọna ṣiṣe DCS ti ilọsiwaju ṣakoso iwọn otutu (45–55°C), iwọn sisan (10–15 m³/h), ati pH (0.8–1.5) pẹlu konge. Awọn afikun adsorb si cathode lati ṣe itọsọna dida ọkà ti ipele nano ati idilọwọ awọn abawọn.
2. Ifiweranṣẹ Ipilẹ: Atomu konge ni Ise
Ninu awọn sẹẹli elekitiroti pẹlu awọn yipo cathode titanium (Ra ≤ 0.1μm) ati awọn anodes alloy alloy, 3000-5000 A/m² DC lọwọlọwọ n ṣe ifisilẹ ion Ejò lori oju cathode ni (220) iṣalaye. Sisanra bankanje (6-70μm) jẹ aifwy ni deede nipasẹ iyara yipo (5-20 m/min) ati awọn atunṣe lọwọlọwọ, ṣiṣe aṣeyọri ± 3% iṣakoso sisanra. Fọọmu tinrin julọ le de 4μm-1/20th sisanra ti irun eniyan.
3. Fifọ: Ultra-Clean Surfaces with Pure Water
Eto yiyi pada ti ipele mẹta ti o yọkuro gbogbo awọn iyokù: Ipele 1 nlo omi mimọ (≤5μS / cm), Ipele 2 kan awọn igbi ultrasonic (40kHz) lati yọkuro awọn itọpa Organic, ati Ipele 3 nlo afẹfẹ ti o gbona (80-100 ° C) fun gbigbẹ ti ko ni iranran. Eleyi àbábọrẹ niEjò bankanjepẹlu awọn ipele atẹgun <100ppm ati awọn iṣẹku imi-ọjọ <0.5μg/cm².
4. Pipin ati Iṣakojọpọ: Itọkasi si Micron Ik
Awọn ẹrọ sliting iyara to gaju pẹlu iṣakoso eti laser rii daju awọn ifarada iwọn laarin ± 0.05mm. Apoti anti-oxidation Vacuum pẹlu awọn itọkasi ọriniinitutu ṣe itọju didara oju ilẹ lakoko gbigbe ati ibi ipamọ.
II. Isọdi Itọju Ilẹ: Ṣiṣii Iṣẹ-iṣẹ Kan pato
1. Awọn itọju Roughening: Micro-Anchoring fun Imudara Imudara
Itọju Nodule:Pulse plating in CuSO₄-H₂SO₄-As₂O₃ ojutu ṣẹda 2-5μm nodules lori bankanje dada, imudarasi adhesion agbara si 1.8-2.5N/mm-apẹrẹ fun 5G Circuit lọọgan.
Roughing Meji-Peak:Micro- ati nano-asekale bàbà patikulu pọ agbegbe dada nipasẹ 300%, imudarasi slurry adhesion ni litiumu batiri anodes nipa 40%.
2. Plating iṣẹ-ṣiṣe: Ihamọra-iwọn-ara-ara-ara fun Itọju
Sikiini/Tin Plating:Apapọ irin 0.1-0.3μm fa iyọda sokiri iyọ lati 4 si awọn wakati 240, ti o jẹ ki o lọ-si fun awọn taabu batiri EV.
Nickel-Cobalt Aso Aso:Pulse-plated nano-grain layers (≤50nm) ṣaṣeyọri líle HV350, ṣe atilẹyin awọn sobusitireti bendable fun awọn fonutologbolori ti a ṣe pọ.
3. Giga-otutu Resistance: Iwalaaye awọn iwọn
Awọn ideri Sol-gel SiO₂-Al₂O₃ (100-200nm) ṣe iranlọwọ bankanje lati koju ifoyina ni 400°C (oxidation <1mg/cm²), ti o jẹ ki o jẹ ibamu pipe fun awọn ọna ṣiṣe onirin afẹfẹ.
III. Fi agbara mu Meta Major ise Furontia
1. New Energy Batiri
CIVEN METAL's 3.5μm bankanje (≥200MPa tensile, ≥3% elongation) pọ si 18650 agbara iwuwo batiri nipasẹ 15%. Aṣa perforated bankanje (30-50% porosity) iranlọwọ lati se idasile lithium dendrite Ibiyi ni ri to-ipinle batiri.
2. Awọn PCB ti ilọsiwaju
Faili kekere-profaili (LP) pẹlu Rz ≤1.5μm dinku pipadanu ifihan agbara ni awọn igbimọ igbi-milimita 5G nipasẹ 20%. Profaili Ultra-kekere (VLP) bankanje pẹlu ipari-itọju-pada (RTF) ṣe atilẹyin awọn oṣuwọn data ti 100Gb/s.
3. Rọ Electronics
AnnealedED Ejò bankanje(≥20% elongation) laminated pẹlu PI fiimu duro lori 200,000 bends (1mm radius), sise bi "egungun rọ" ti wearables.
IV. CIVEN METAL: Alakoso isọdi ni ED Ejò Foil
Gẹgẹbi ile agbara idakẹjẹ ni bankanje idẹ ED,CIVEN irinti kọ ohun agile, apọjuwọn ẹrọ ẹrọ:
Nano-Aditive Library:Ju awọn akojọpọ afikun 200 ti a ṣe deede fun agbara fifẹ giga, elongation, ati iduroṣinṣin gbona.
Ṣiṣejade Fáìlì Ìtọnisọ́nà:AI-iṣapeye sile rii daju ± 1.5% sisanra išedede ati ≤2I flatness.
Ibudo Itọju Dada:Awọn laini iyasọtọ 12 ti o funni ni awọn aṣayan isọdi 20+ (roughening, plating, covers).
Indotunse iye owo:Imularada egbin inu laini ṣe alekun lilo bàbà aise si 99.8%, idinku awọn idiyele bankanje aṣa nipasẹ 10–15% ni isalẹ apapọ ọja.
Lati iṣakoso lattice atomiki si iṣatunṣe iṣẹ ṣiṣe iwọn Makiro,ED Ejò bankanjeduro fun akoko tuntun ti imọ-ẹrọ ohun elo. Bi iṣipopada agbaye si ọna itanna ati awọn ẹrọ ọlọgbọn n yara,CIVEN irinṢe itọsọna idiyele pẹlu awoṣe “aṣoju atomiki + imudara ohun elo” rẹ—titari iṣelọpọ ilọsiwaju China si oke ti pq iye agbaye.
Akoko ifiweranṣẹ: Jun-03-2025