Roughening Post-Itọju ti Ejò bankanje: “Titiipa oran” Technology Interface ati okeerẹ elo Analysis

Ni aaye tiEjò bankanjeẹrọ, roughening ranse si-itọju ni awọn bọtini ilana fun šiši awọn ohun elo ti ni wiwo imora agbara. Nkan yii ṣe itupalẹ iwulo ti itọju roughening lati awọn iwo mẹta: ipa anchoring darí, awọn ọna imuse ilana, ati isọdọtun lilo ipari. O tun ṣawari iye ohun elo ti imọ-ẹrọ yii ni awọn aaye bii ibaraẹnisọrọ 5G ati awọn batiri agbara tuntun, da loriCIVEN irin'S imọ aseyori.

1. Itọju Roughening: Lati “Pakute Dan” si “Anchored Interface”

1.1 Awọn abawọn Apaniyan ti Dada Dan

Awọn atilẹba roughness (Ra) tiEjò bankanjeAwọn oju ilẹ jẹ deede kere ju 0.3μm, eyiti o yori si awọn ọran wọnyi nitori awọn abuda-digi rẹ:

• Insufficient Ara imora: Agbegbe olubasọrọ pẹlu resini jẹ nikan 60-70% ti awọn tumq si iye.
• Kemikali imora idena: Layer ohun elo afẹfẹ ipon (Cu₂O sisanra nipa 3-5nm) ṣe idiwọ ifihan ti awọn ẹgbẹ ti nṣiṣe lọwọ.
• Gbona Wahala ifamọAwọn iyatọ ninu CTE (Olusọdipupọ ti Imugboroosi Gbona) le fa delamination wiwo (ΔCTE = 12ppm/°C).

1.2 Meta Key Technical Breakthroughs ni Roughening ilana

Nipa ṣiṣẹda igbekalẹ onisẹpo mẹta ipele micron (wo Nọmba 1), Layer roughened ṣe aṣeyọri:

• Darí Interlocking: Resini ilaluja fọọmu "barbed" anchoring (ijinle> 5μm).
• Ṣiṣẹ kemikali: Ṣiṣafihan (111) awọn ọkọ ofurufu kirisita iṣẹ-giga pọ si iwuwo aaye isunmọ si awọn aaye 10⁵/μm².
• Ifipamọ Wahala Gbona: Awọn la kọja be fa lori 60% ti gbona wahala.
• Ilana IlanaOjutu dida Ejò ekikan (CuSO₄ 80g/L, H₂SO₄ 100g/L) + Polusi Electro-iṣaro (ojuse ọmọ 30%, igbohunsafẹfẹ 100Hz)
• Awọn ẹya ara ẹrọ igbekale:
  • Ejò dendrite iga 1.2-1.8μm, iwọn ila opin 0.5-1.2μm.
  • Akoonu atẹgun oju ≤200ppm (itupalẹ XPS).
  • Idaabobo olubasọrọ <0.8mΩ·cm².
• Ilana Ilana: Cobalt-nickel alloy plating ojutu (Co²+ 15g/L, Ni²+ 10g/L) + Kemikali Iṣipopada Idahun (pH 2.5-3.0)
• Awọn ẹya ara ẹrọ igbekale:
  • Iwọn patiku alloy CoNi 0.3-0.8μm, iwuwo stacking> 8 × 10⁴ patikulu / mm².
  • Akoonu atẹgun oju ≤150ppm.
  • Idaabobo olubasọrọ <0.5mΩ·cm².

2. Red Oxidation vs Black Oxidation: Awọn Aṣiri Ilana Lẹhin Awọn awọ

2.1 Oxidiation Pupa: “Ihamọra” ti Ejò

2.2 Black Oxidation: Alloy “Armor”

2.3 Commercial kannaa Sile Awọ Yiyan

Botilẹjẹpe awọn itọkasi iṣẹ ṣiṣe bọtini (adhesion ati conductivity) ti pupa ati ifoyina dudu yatọ nipasẹ o kere ju 10%, ọja naa ṣafihan iyatọ ti o han gbangba:

• Red Oxidized Ejò bankanjeAwọn akọọlẹ fun 60% ti ipin ọja nitori anfani idiyele pataki rẹ (12 CNY/m² vs. dudu 18 CNY/m²).
• Black Oxidized Ejò bankanje: O jẹ gaba lori ọja ti o ga julọ (FPC ti a gbe ọkọ ayọkẹlẹ, awọn PCBs-igbi-milimita) pẹlu ipin ọja 75% nitori:
  • 15% idinku ninu awọn adanu igbohunsafẹfẹ-giga (Df = 0.008 vs. oxidation pupa 0.0095 ni 10GHz).
  • 30% ilọsiwaju CAF (Conductive Anodic Filament) resistance.

3. CIVEN irin: "Nano-Level Masters" ti Roughening Technology

3.1 Innovative "Gradient Roughening" Technology

Nipasẹ iṣakoso ilana ipele mẹta,CIVEN irino mu eto dada pọ si (wo Nọmba 2):

1. Nano-Crystalline Irugbin Layer: Ipilẹ-itanna ti awọn ohun kohun bàbà 5-10nm ni iwọn, iwuwo> 1×10¹¹ patikulu/cm².
2. Micron Dendrite Growth: Pulse lọwọlọwọ idari dendrite iṣalaye (prioritizing awọn (110) itọsọna).
3. Dada Passivation: Organic silane coupling oluranlowo (APTES) bo se ifoyina resistance.

3.2 Performance Nlọ Industry Standards

3.3 Ipari-Lo Awọn ohun elo Matrix

• 5G Mimọ Ibusọ PCB: Nlo dudu oxidized bankanjele (Ra = 1.5μm) lati se aseyori <0.15dB/cm pipadanu ifibọ ni 28GHz.
• Agbara Batiri Alakojo: Red oxidizedEjò bankanje(agbara fifẹ 380MPa) pese igbesi aye ọmọ> Awọn akoko 2000 (awọn ipele 1500 ti orilẹ-ede).
• Awọn FPCs Ofurufu: Awọn roughened Layer withstand gbona mọnamọna lati -196 ° C to +200 ° C fun 100 waye lai delamination.

4. Oju ogun ojo iwaju fun Iyanje Ejò Roughened

4.1 Ultra-Roughening Technology

Fun awọn ibeere ibaraẹnisọrọ terahertz 6G, eto serrated pẹlu Ra = 3-5μm ti wa ni idagbasoke:

• Dielectric Constant Iduroṣinṣin: Imudara si ΔDk <0.01 (1-100GHz).
• Gbona Resistance: Dinku nipasẹ 40% (aṣeyọri 15W/m·K).

4.2 Smart Roughening Systems

Ṣiṣawari iran iran AI ti irẹpọ + atunṣe ilana agbara:

• Real-Time dada Abojuto: igbohunsafẹfẹ iṣapẹẹrẹ 100 awọn fireemu fun keji.
• Aṣamubadọgba lọwọlọwọ iwuwo tolesese: konge ± 0.5A/dm².

Fíìlì bàbà roughening lẹhin-itọju ti wa lati “ilana yiyan” si “ilọpo iṣẹ.” Nipasẹ isọdọtun ilana ati iṣakoso didara to gaju,CIVEN irinti tẹ imọ-ẹrọ roughening si konge ipele atomiki, pese atilẹyin ohun elo ipilẹ fun igbesoke ti ile-iṣẹ itanna. Ni ọjọ iwaju, ninu ere-ije fun ijafafa, igbohunsafẹfẹ giga, ati awọn imọ-ẹrọ ti o ni igbẹkẹle diẹ sii, ẹnikẹni ti o ba ni oye “koodu ipele-micro” ti imọ-ẹrọ roughening yoo jẹ gaba lori ilẹ giga ilana tiEjò bankanjeile ise.

( Orisun data:CIVEN irin2023 Iroyin Imọ-ẹrọ Ọdọọdun, IPC-4562A-2020, IEC 61249-2-21)