Idẹ Tin Tin Ejò: Solusan Iwọn Nano kan fun Tita ati Idaabobo Ipese

Tin plating pese a "ra ti fadaka ihamọra" funEjò bankanje, ijqra awọn pipe iwontunwonsi laarin solderability, ipata resistance, ati iye owo ṣiṣe. Nkan yii fọ lulẹ bii bankanje idẹ-palara tin ti di ohun elo mojuto fun olumulo ati ẹrọ itanna adaṣe. O ṣe afihan awọn ilana isunmọ atomiki bọtini, awọn ilana imotuntun, ati awọn ohun elo lilo ipari, lakoko ti n ṣawariCIVEN irin's advancements ni Tinah plating ọna ẹrọ.

1. Meta Key anfani ti Tin Plating
1.1 A kuatomu fifo ni Soldering Performance
Layer tin (ni ayika 2.0μm nipọn) ṣe iyipada tita ni awọn ọna pupọ:
– Tita ni iwọn otutu kekere: Tin yo ni 231.9°C, o dinku iwọn otutu tita lati 850°C ti bàbà si 250–300°C nikan.
- Imudara Wetting: Tin's dada ẹdọfu silẹ lati 1.3N/m Ejò si 0.5N/m, jijẹ awọn solder itankale agbegbe nipa 80%.
- Awọn IMC ti o dara julọ (Awọn akopọ intermetallic): Layer gradient Cu₆Sn₅/Cu₃Sn mu agbara rirẹ pọ si 45MPa (iṣiro bàbà igboro ṣaṣeyọri 28MPa nikan).
1.2 Atako Ibaje: “Idena Ayika”
| Ibaje ohn | Igboro Ejò Ikuna Time | Tin-Pated Ejò Ikuna Time | Idaabobo ifosiwewe |
| Ise Atmosphere | 6 osu (alawọ ewe ipata) | Ọdun 5 (pipadanu iwuwo <2%) | 10x |
| Ibaje lagun (pH=5) | 72 wakati (perforation) | 1.500 wakati (ko si bibajẹ) | 20x |
| Hydrogen Sulfide Ipata | 48 wakati (dudu) | 800 wakati (ko si discoloration) | 16x |
1.3 Conductivity: A "Micro-ẹbọ" nwon.Mirza
-Atako eletiriki n pọ si diẹ diẹ, nipasẹ 12% (1.72×10⁸ si 1.93×10⁻⁸ Ω·m).
- Ipa awọ ara ni ilọsiwaju: Ni 10GHz, ijinle awọ ara pọ si lati 0.66μm si 0.72μm, ti o mu abajade pipadanu ifibọ ti o kan 0.02dB/cm.

2. Awọn italaya ilana: “Ige vs. Plating”
2.1 Pipin ni kikun (Ige Ṣaaju Pilẹ)
- Awọn anfani: Awọn eti ti wa ni kikun bo, laisi bàbà ti o han.
- Awọn italaya Imọ-ẹrọ:
- Burrs gbọdọ wa ni iṣakoso ni isalẹ 5μm (awọn ilana aṣa kọja 15μm).
- Ojutu didasilẹ gbọdọ wọ diẹ sii ju 50μm lati rii daju agbegbe eti aṣọ.
2.2 Pipin-Ge (Pating Ṣaaju Ige)
- Awọn anfani iye owo: Ṣe alekun ṣiṣe ṣiṣe nipasẹ 30%.
- Awọn nkan pataki:
- Awọn egbegbe Ejò ti o han lati 100-200μm.
- Igbesi aye sokiri iyọ dinku nipasẹ 40% (lati awọn wakati 2,000 si awọn wakati 1,200).
2.3CIVEN irinỌna “Alaebu odo” ti ọna
Apapọ gige konge lesa pẹlu pulse tin plating:
- Ige Yiye: Burrs pa labẹ 2μm (Ra = 0.1μm).
- Edge Coverage: Side fifin sisanra ≥0.3μm.
- Iye owo-ṣiṣe: Awọn idiyele 18% dinku ju awọn ọna fifin ni kikun ibile.

3. CIVEN irinTin-PatedEjò bankanje: Igbeyawo ti Imọ ati Aesthetics
3.1 kongẹ Iṣakoso ti a bo Mọfoloji
| Iru | Ilana Ilana | Key Awọn ẹya ara ẹrọ |
| Tin Imọlẹ | Awọn iwuwo lọwọlọwọ: 2A/dm², aropo A-2036 | Ifojusi> 85%, Ra = 0.05μm |
| Matte Tin | Iwọn lọwọlọwọ: 0.8A/dm², ko si awọn afikun | Iṣaro <30%, Ra=0.8μm |
3.2 Superior Performance Metiriki
| Metiriki | Industry Apapọ |CIVEN irinTin-palara Ejò | Ilọsiwaju |
| Iyapa Sisanra (%) | ± 20 | ± 5 | -75% |
| Solder ofo Oṣuwọn (%) | 8–12 | ≤3 | -67% |
| Tẹ Resistance (awọn kẹkẹ) | 500 (R=1mm) | 1.500 | + 200% |
| Tin Whisker Growth (μm/1,000h) | 10–15 | ≤2 | -80% |
3.3 Key elo Area
- Foonuiyara FPCs: Matte tin (sisanra 0.8μm) ṣe idaniloju titaja iduroṣinṣin fun laini 30μm / aaye.
- Awọn ọkọ ayọkẹlẹ ECUs: Tin Imọlẹ duro duro 3,000 awọn iyipo igbona (-40 ° C↔ + 125 ° C) laisi ikuna apapọ solder.
- Photovoltaic Junction Apoti: Tin tin ti o ni ilọpo meji (1.2μm) ṣe aṣeyọri resistance olubasọrọ <0.5mΩ, igbelaruge ṣiṣe nipasẹ 0.3%.

4. Ojo iwaju ti Tin Plating
4.1 Nano-Composite Coatings
Dagbasoke Sn-Bi-Ag ternary alloy Co.
- Isalẹ yo ojuami si 138 ° C (apẹrẹ fun kekere-otutu rọ Electronics).
- Ṣe ilọsiwaju resistance ti nrakò nipasẹ 3x (ju awọn wakati 10,000 lọ ni 125°C).
4.2 Green Tin Plating Iyika
Awọn Solusan Ọfẹ Cyanide: Din COD omi idọti silẹ lati 5,000mg/L si 50mg/L.
- Iwọn Imularada Tin Ga: Ju 99.9%, awọn idiyele ilana gige nipasẹ 25%.
Tin plating yipadaEjò bankanjelati oludari ipilẹ kan sinu “ohun elo wiwo ti oye.”CIVEN irin'S atomiki-ipele ilana Iṣakoso Titari awọn igbekele ati ayika resilience ti Tin-palara Ejò bankanje si titun Giga. Bi awọn ẹrọ itanna onibara ṣe dinku ati ẹrọ itanna eleto beere igbẹkẹle ti o ga julọ,Tin-palara Ejò bankanjeti wa ni di awọn igun ti awọn Asopọmọra Iyika.