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Awọn iroyin wa

  • Pastivated ti yiyi injar cort: crafting aworan ti "awọn apata aabo aabo" ati iwọntunwọnsi iṣẹ

    Pataki jẹ ilana asiko-iṣe ni iṣelọpọ ti yiyi inbu corùt. O ṣe gẹgẹ bi "asà ipele ti molecular" lori dada, imudara resistance ipalu nigba ti o ba ni iwọntunwọnsi ikolu iru awọn ohun-ini to ṣe pataki ati iwa-ipa. This article delves into the science behind ...

  • Awọn asopọ jẹ awọn paati pataki ninu awọn ẹrọ itanna ati awọn ọna itanna ti igbalode, aridaju awọn asopọ itanna fun gbigbe data, ifijiṣẹ agbara, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan, ati iduroṣinṣin ifihan With the growing demand for higher performance and miniaturization, connectors are increasingly critical acros...

  • Irunfun itọju ti yiyi inlobu ibanilẹru

    Ti yiyi fanubu womo jẹ ohun elo mojuto ninu ile-iṣẹ Clat Contratronic, ati mimọ ti inu ẹrọ taara taara pinnu igbẹkẹle awọn ilana ilana bii ti a bo ati ifọju igbona. This article analyzes the mechanism by which degreasing treatment optimizes the per...

  • Awọn asopọ Sitirin ni awọn ẹrọ ti o ṣe pataki ni awọn ẹrọ itanna, aridaju awọn asopọ itanna daradara fun gbigbe agbara, gbigbe fowo si, ati idapọmọra ẹrọ. With increasing demands for high performance and compact designs in electronics, material selection for terminal connectors...

  • Awọn ohun elo ooru ti o ni ila-giga jẹ awọn ohun elo igbona-giga giga ti a ṣe fun sisọ ooru ni awọn ẹrọ itanna ati awọn eto agbara giga. Pẹlu adaṣe igbona mimu, agbara ẹrọ, ati ifimu aṣoju, wọn ni lilo pupọ kọja awọn ile-iṣẹ pupọ, lati ọdọ alabara ...

  • Igbonugbo (ti parẹ Hoosalated ẹnu-ọna ti a ti sọ silẹ) jẹ paati mojuto ninu awọn ọna ẹrọ itanna ti awọn ọkọ agbara tuntun (nevs), nipataki lilo fun iyipada agbara ati iṣakoso. As a highly efficient semiconductor device, IGBT plays a critical role in vehicle efficiency and reliability. CIVEN METAL&#...

  • Lead frames are indispensable core materials in the modern electronics industry. Wọn ni lilo ni lilo ni lilo idapọmọra, awọn eerun ti o pọ si awọn iyika ita ati aridaju iduroṣinṣin ati igbẹkẹle ti awọn ẹrọ itanna. From smartphones and household appliances to automotive electro...

  • Electrolytic nickel foil is a critical material characterized by excellent conductivity, corrosion resistance, and high-temperature stability. O ti rii awọn ohun elo gbooro ninu awọn batiri Litiumu-IL, awọn sẹẹli idana hlydrogen, ati aerospoace, ṣiṣẹ bi ipilẹ fun imọ-ẹrọ ...

  • Ni ọpọlọpọ awọn ohun elo igbalode, awọn ohun elo asopọ asopọ rirọ ṣe pataki fun irọrun iyọrisi, igbẹkẹle, ati agbara ninu awọn asopọ itanna. Copper foil has emerged as the material of choice for flexible connections due to its excellent conductivity, malleability, and strength. CIVEN ME...

  • Ni ile-iṣẹ ohun elo ohun elo giga-ode sẹhin ti ode oni, yiyan ohun elo taara ipa ti o daju gbigbe gbigbe ohun orin ati iriri akiyesi olumulo. Bankan banki, pẹlu gbigba agbara giga rẹ ati gbigbe ami idanimọ rẹ, ti di ohun elo ti o fẹran fun awọn apẹẹrẹ ohun elo ohun ati en ...

  • Lati Oṣukànlá 12th si 15th, irin ti o can yoo kopa ninu ẹrọ itanna 2024 ni Ilu Munich, Jẹmánì, Jẹmánì, Jẹmánì. Awọn iho wa yoo wa ni ile gbongan C6, Booth 221/9. Gẹgẹbi ọkan ninu awọn iṣowo iṣowo ti agbaye fun ile-iṣẹ itanna, itanna ṣe ifamọra awọn ile-iṣẹ ati awọn akosemose lati kọja gly ...

  • Ni afikun si lilo rẹ lọwọlọwọ ninu Anodes ti awọn batiri agbara, bankanje ECA le ni ọpọlọpọ awọn ohun elo iwaju miiran bi awọn iṣoro imọ-ẹrọ ati awọn imọ-ẹrọ batiri ti n yi. Here are some potential future uses and developments: 1. Solid-State Batteries Current Collectors and Conductive Networks...

  • Ni awọn ohun elo ibaraẹnisọrọ iwaju 5g, awọn ohun elo ti bankanje ec yoo gbooro si siwaju, ni akọkọ ni awọn agbegbe atẹle: 5G ti a tẹjade Ipilẹṣẹ Ejò nilo imọ-ẹrọ gbigbe-ilẹ giga ti o ga julọ.

  • Awọki ECP ti n dagba diẹ sii ṣe pataki ni idinwo cur chirún nitori adaṣe igbona rẹ, ṣiṣeeṣe, ati idiyele-iye. Here is a detailed analysis of its specific applications in chip packaging: 1. Copper Wire Bonding Replacement for Gold or Aluminum W...

  • Oye ti o ni ijinle ti iṣelọpọ iṣelọpọ, ati awọn ohun elo ti itọju elede

    I. Akopọ ti Egan Ejò ti a tọju ti a tọju ni itọju ti a tọju sile ti o ni afikun ti o wa labẹ awọn ohun-ini itọju dada, ṣiṣe ti o dara fun awọn ohun elo pupọ. This type of copper foil is widely used in electronics, electrical, communicati...

  • Agbara Tensele ati Elonation ti enper banki jẹ awọn olufihan ohun-ini pataki meji, ati pe ibatan kan wa laarin wọn, eyiti o kan taara taara ati igbẹkẹle ti bankan banki. Tensile strength refers to the ability of copper foil to resist tensile fract...

  • The annealing process of copper foil is an important step in the production of copper foil. O pẹlu alapapo awọn eepo idẹ si iwọn otutu kan, dani ni akoko kan, ati lẹhinna ni itutu agba ati awọn ohun-ini ti gara ati awọn ohun-ini ti bankanje. The main purpose of annealing ...

  • I. Akopọ ati itan idagbasoke ti Batper Clad ti o rọ Laini (FCL) jẹ ohun elo bralute clad (fccl) jẹ bankanje papọ nipasẹ awọn ilana kan pato. FCCL was first introduced in the 1960s, initially used primarily ...

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